Broadband Hetero-Integration of InP Chiplets on SiGe BiCMOS for mm-Wave MMICs up to 325GHz
Author:
Affiliation:
1. Leibniz-Institut für Höchstfrequenztechnik,Ferdinand-Braun-Institut (FBH),Berlin,Germany
2. Leibniz-Institut für Innovative Mikroelektronik,IHP,Frankfurt (Oder),Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10187888/10187785/10188164.pdf?arnumber=10188164
Reference5 articles.
1. Technology for the Heterointegration of InP DHBT Chiplets on a SiGe BiCMOS Chip for mm-wave MMICs
2. Effect of Oxidation on Indium Solderability
3. A multiline method of network analyzer calibration
4. Terahertz Signal Source and Receiver Operating Near 600 GHz and Their 3-D Imaging Application
5. Ultra-high-speed 300-GHz InP IC Technology for Beyond 5G
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