A Dual-Band Micromachined On-Wafer Probe with Integrated Diplexer for Ultra-Broadband Measurements to 220 GHz
Author:
Affiliation:
1. Dominion MicroProbes, Inc. (DMPI),USA
2. University of Virginia (UVa),USA
3. Karlsruhe Institute of Technology (KIT),Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10187888/10187785/10187983.pdf?arnumber=10187983
Reference13 articles.
1. A Differential Probe with Integrated Balun for On-wafer Measurements in the WR-3.4 (220 – 330 GHz) Waveguide Band
2. Silicon-on-Insulator Substrates as a Micromachining Platform for Advanced Terahertz Circuits
3. 160 GHz Balanced Frequency Quadruplers Based on Quasi-Vertical Schottky Varactors Integrated on Micromachined Silicon
4. Improved Micromachined Terahertz On-Wafer Probe Using Integrated Strain Sensor
5. 70 kHz-145 GHz broadband S-parameter measurements: Calibration and verification possibilities
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