Author:
Parlak Murat,Oksuz Selcuk
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Novel Thermal Packaging Approach for an Airtight Electronic Chassis without Card Retainer-II;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. Novel Thermal Packaging Approach for an Airtight Electronic Chassis without Card Retainer-I;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30