Stress-buffer and passivation processes for Si and GaAs IC's and passive components using photosensitive BCB: process technology and reliability data-Reference-Cited by-同舟云学术

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Stress-buffer and passivation processes for Si and GaAs IC's and passive components using photosensitive BCB: process technology and reliability data

Published:1999 Issue:3 Volume:22 Page:487-498
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Ganrou P.E.,Rogers W.B.,Scheck D.M.,Strandjord A.J.G.,Ida Y.,Ohba K.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/17029/00784503.pdf?arnumber=784503

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3. Low‐Dielectric Constant and Low‐Temperature Curable Polyimide/POSS Nanocomposites;Macromolecular Materials and Engineering;2019-10-14

4. Electro-Absorption Modulator Vertically Integrated on a VCSEL: Microstrip-Based High-Speed Electrical Injection on Top of a BCB Layer;Journal of Lightwave Technology;2019-08-01

5. Improved package reliability of AlGaN/GaN HFETs on 150mm Si substrates by SiNx/polyimide dual passivation layers;Surface and Coatings Technology;2016-12

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