High-Power LED Chip-on-Board Packages With Diamond-Like Carbon Heat-Spreading Layers

Author:

Tsai Pai-Yang,Huang Hou-Kuei,Sung Chien-Min,Kan Ming-Chi,Wang Yeong-Her

Funder

Ministry of Science and Technology Taiwan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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2. A Review on Light-Emitting-Diodes Characteristics;2022 International Conference on Intelligent Controller and Computing for Smart Power (ICICCSP);2022-07-21

3. Hollow-cathode chemical vapor deposition of thick, low-stress diamond-like carbon films;Thin Solid Films;2020-11

4. Design of a Small-Angle Reflector for Shadowless Illumination;Lecture Notes in Electrical Engineering;2020

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