Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Thermal Design of Heatsink for M.2 NVMe SSD Reliability;Journal of the Korean Society for Precision Engineering;2023-05-01
2. Thermal modeling and analysis of a power ball grid array in system-in-package technology;Multiscale and Multidisciplinary Modeling, Experiments and Design;2021-09-10