Hardware Verification of Via Crosstalk Cancellation for Differential BGA-to-BGA Links

Author:

Scharff Katharina1,Duan Xiaomin1,Cocchini Matteo2,Nguyen Hung2,Selezinski Nicole3,Kaller Dierk1,Harrer Hubert1

Affiliation:

1. IBM Deutschland Research & Development GmbH,Germany

2. IBM Systems, IBM Corporation,USA

3. Hamburg University of Technology,Germany

Publisher

IEEE

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Impact of BGA Package Failure on Crosstalk in Microwave Circuits Using GSG Structure;IEEE Transactions on Electromagnetic Compatibility;2024-08

2. Routing Length Impact on Differential Via Crosstalk Cancellation;2023 IEEE 27th Workshop on Signal and Power Integrity (SPI);2023-05-07

3. Extracting Anisotropic Permittivity of PCB Substrate from VNA Measurement on a Rectangular Stripline Resonator Loaded with a Via Array;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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