Hierarchical Capacity Planning With Reconfigurable Kits in Global Semiconductor Assembly and Test Manufacturing-Reference-Cited by-同舟云学术

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Hierarchical Capacity Planning With Reconfigurable Kits in Global Semiconductor Assembly and Test Manufacturing

Published:2007-10 Issue:4 Volume:4 Page:543-552
ISSN:1545-5955
Container-title:IEEE Transactions on Automation Science and Engineering
language:
Short-container-title:IEEE Trans. Automat. Sci. Eng.

Author:

Zhang Mike Tao,Niu Sophia,Deng Shiming,Zhang Zhicong,Li Qi,Zheng Li

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx5/8856/4312826/04312837.pdf?arnumber=4312837

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