High-Power High-Speed MUTC Waveguide Photodiodes Integrated on Si<sub>3</sub>N<sub>4</sub>/Si Platform Using Micro-Transfer Printing-Reference-Cited by-同舟云学术

High-Power High-Speed MUTC Waveguide Photodiodes Integrated on Si₃N₄/Si Platform Using Micro-Transfer Printing

Published:2022 Issue: Volume: Page:1-6
ISSN:1077-260X
Container-title:IEEE Journal of Selected Topics in Quantum Electronics
language:
Short-container-title:IEEE J. Select. Topics Quantum Electron.

Author:

Yu Fengxin¹^ORCID,Tzu Ta-Ching¹^ORCID,Gao Junyi¹,Fatema Tasneem¹,Sun Keye¹^ORCID,Singaraju Prerana¹,Bowers Steven M.¹^ORCID,Reyes Christopher²,Beling Andreas¹^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, University of Virginia, Charlottesville, VA, USA

2. X-Celeprint Inc., Research Triangle Park, NC, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/2944/4481213/09954134.pdf?arnumber=9954134

Reference24 articles.

1. Transfer printing by kinetic control of adhesion to an elastomeric stamp

2. Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors

3. Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride waveguides for near-infrared applications

4. Heterogeneous integration of Si photodiodes on silicon nitride for near-visible light detection

5. Transfer Print Integration of Waveguide-Coupled Germanium Photodiodes Onto Passive Silicon Photonic ICs

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