Author:
Peng Yarui,Jung Moongon,Song Taigon,Wan Yang,Lim Sung Kyu
Cited by
5 articles.
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2. Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture;2021 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED);2021-07-26
3. Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs;Proceedings of the 2020 International Symposium on Physical Design;2020-03-20
4. Best of both worlds;Proceedings of the International Conference on Computer-Aided Design;2018-11-05
5. Resilience Against Side-Channel Attacks in Emerging Technologies;The Next Era in Hardware Security;2012-02-24