Power distribution network (PDN) design and analysis of a single and double-sided high bandwidth memory (HBM) interposer for 2.5D Terabtye/s bandwidth system
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/7565235/7571555/07571620.pdf?arnumber=7571620
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
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2. A 3-D Convolutional Network for Fast and Accurate S/Z-Parameters Prediction of Si-Interposer Power Distribution Network With Through Silicon Vias;IEEE Transactions on Circuits and Systems II: Express Briefs;2024-05
3. Analysis and Design of the Interposer PDN With Optimal Arrangement of Decoupling Capacitors;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-02
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5. A Statistical Approach for Signal and Power Integrity Co-Design in High-Speed Interconnects Considering Non-Linear Power/Ground Noise and Bit-Patterns;Micromachines;2023-08-22
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