Author:
Ding Yifan,Zhao Biyao,Liang Shuang,Bai Siqi,Connor Samuel,Cocchini Matteo,Achkir Brice,Scearce Stephen,Li Erping,Archambeault B.,Fan Jun,Drewniak James
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
2. Equivalent Force Extraction Methodology for Electrical Component Induced PCB Vibration;IEEE Transactions on Electromagnetic Compatibility;2023
3. Physics-Based Modeling for Determining Transient Current Flow In Multi-layer PCB PI Designs;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01
4. A Methodical Approach for PCB PDN Decoupling Minimizing Overdesign with Genetic Algorithm Optimization;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01
5. Modeling of Loaded Nonuniform Grid Power Distribution Network With Arbitrary Shapes;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-01