Author:
He Jiayi,Hwang Chulsoon,Pan Jingnan,Cho Gyu-Yeong,Bae Bumhee,Park Hark-Byeong,Fan Jun
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Characterization of a Microstrip Line Referenced to a Meshed Return Plane Using 2-D Analysis;IEEE Transactions on Signal and Power Integrity;2024
2. Modeling and Analysis of Simultaneous Switching Noise for Full Wafer Scale Chip Core;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
3. Design and Analysis of an Irregular-Shaped Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
4. Analysis of Mesh Ground Impact on Microstrip Lines in Flexible Printed Circuits;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
5. Modeling of a Microstrip Line Referenced to a Meshed Return Plane;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29