Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal Solver Enhanced with Decay Curve Characterization-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal Solver Enhanced with Decay Curve Characterization

Published:2023-10-28 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)
language:
Short-container-title:

Author:

He Haiyang¹,Chang Norman¹,Yang Jie¹,Kumar Akhilesh¹,Xia Wenbo¹,Lin Lang¹,Ranade Rishikesh¹

Affiliation:

1. Ansys Inc.,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10323590/10323543/10323972.pdf?arnumber=10323972

Reference22 articles.

1. Rate Bounds on SSIM Index of Quantized Images

2. Image Quality Assessment: From Error Visibility to Structural Similarity

3. A Survey of Chip Level Thermal Simulators;sultan;ACM Comput Surv,2019

4. Video quality assessment based on structural distortion measurement;wang;Signal Processing Image Communication,2004

5. PEAKASO: peak-temperature aware scan-vector optimization;cho;24th IEEE VLSI Test Symposium,0

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Parallel Per-tile Activation with Linear Superposition of Thermal Response for Solving Arbitrary Power Pattern in 3DIC Thermal Simulation;Proceedings of the 2024 ACM/IEEE International Symposium on Machine Learning for CAD;2024-09-09

2. Solving 3D-IC Multiphysics Challenges with a Novel ML-Assisted Co-Optimization Methodology;2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA);2024-04-22

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP