1. Carrier Systems for Collective Die-to-Wafer Bonding
2. Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks
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4. Configurable Multi-Product Floorplanning;ma;Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC),0
5. Impact of Manufacturing Process Variations on Performance and Thermal Characteristics of 3D ICs: Emerging Challenges and New Solutions;juan;Proceedings of IEEE International Symposium on Circuits and Systems (ISCAS),0