Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits-Reference-Cited by-同舟云学术

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Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits

Published:2022 Issue: Volume: Page:1-1
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Coenen David¹^ORCID,Oprins Herman²^ORCID,Degraeve Robin²^ORCID,Wolf Ingrid De¹^ORCID

Affiliation:

1. Dept. Materials Eng. KU Leuven, Leuven, Belgium

2. imec, Leuven, Belgium

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx7/43/6917053/09926195.pdf?arnumber=9926195

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Heat transfer enhancement for 3D chip thermal simulation and prediction;Applied Thermal Engineering;2024-01

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