M2A2: Microscale Modular Assembled ASICs for High-Mix, Low-Volume, Heterogeneously Integrated Designs
-
Published:2020-12
Issue:12
Volume:39
Page:4760-4776
-
ISSN:0278-0070
-
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
-
language:
-
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.
Author:
Sayal AseemORCID,
Ajay Paras,
McDermott Mark W.,
Sreenivasan S. V.,
Kulkarni Jaydeep P.ORCID
Funder
Cockrell School of Engineering and by the NASCENT Center’s Nanoengineering Online Education Program at the University of Texas at Austin
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Low Power APB with an Area Efficient Structure;2023 2nd International Conference for Innovation in Technology (INOCON);2023-03-03