Electrothermal Simulation and Optimal Design of Thermoelectric Cooler using Analytical Approach-Reference-Cited by-同舟云学术

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Electrothermal Simulation and Optimal Design of Thermoelectric Cooler using Analytical Approach

Published:2021 Issue: Volume: Page:1-1
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Chen Liang,Sadiqbatcha Sheriff,Amrouch Hussam,Tan Sheldon X.-D.

Funder

NSF

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx7/43/6917053/09576529.pdf?arnumber=9576529

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermoelectric Cooler Modeling and Optimization via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-11

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