Author:
Park Sangmin,Cheong Minho,Han Donghyun,Kang Sungho
Funder
National Research Foundation of KoreaNRF
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. LOTS: Low Overhead TSV Repair Method Using IEEE-1838 Standard Architecture;2023 20th International SoC Design Conference (ISOCC);2023-10-25
2. TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-04
3. TRUST: Through-Silicon Via Repair Using Switch Matrix Topology;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022