Zinc whiskers: hidden cause of equipment failure
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Computer Science Applications,Hardware and Architecture,Software
Link
http://xplorestaging.ieee.org/ielx5/6294/30282/01390872.pdf?arnumber=1390872
Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Formation and evolution mechanism of metal whiskers in extreme aerospace environments: A review;Chinese Journal of Aeronautics;2023-09
2. Electro-Thermal Modeling of One-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc and Indium;Thermal Science and Engineering Progress;2023-06
3. Revealing the Pb Whisker Growth Mechanism from Al-Alloy Surface and Morphological Dependency on Material Stress and Growth Environment;Materials;2022-03-31
4. Extraordinary Nanocrystalline Pb Whisker Growth from Bi-Mg-Pb Pools in Aluminum Alloy 6026 Moderated through Oriented Attachment;Nanomaterials;2021-07-16
5. Influence of organic additives on the behaviour of zinc electroplating from alkaline cyanide-free electrolyte;Transactions of the IMF;2017-03-02
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