A neural network approach to the inspection of ball grid array solder joints on printed circuit boards-Reference-Cited by-同舟云学术

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A neural network approach to the inspection of ball grid array solder joints on printed circuit boards

Published:2000 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the IEEE-INNS-ENNS International Joint Conference on Neural Networks. IJCNN 2000. Neural Computing: New Challenges and Perspectives for the New Millennium
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Author:

Kuk Won Ko ,Young Jun Roh ,Hyung Suck Cho ,Hyung Cheol Kimn

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6927/18674/00861463.pdf?arnumber=861463

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Automated void detection in high resolution x-ray printed circuit boards (PCBs) images with deep segmentation neural network;Engineering Applications of Artificial Intelligence;2024-07

2. A novel solder joints inspection method using curvature and geometry features in high-density flexible IC substrates surface mount technology;Physica Scripta;2021-11-25

3. Optimization Methods on the Wavelet Transformation Base for Technical Diagnostic Information Systems;2021 11th IEEE International Conference on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications (IDAACS);2021-09-22

4. An online machine learning framework for early detection of product failures in an Industry 4.0 context;International Journal of Computer Integrated Manufacturing;2019-02-02

5. A Line-Based-Clustering Approach for Ball Grid Array Component Inspection in Surface-Mount Technology;IEEE Transactions on Industrial Electronics;2017-04

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