The effect of power cycling on the reliability of lead-free surface mount assemblies-Reference-Cited by-同舟云学术

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The effect of power cycling on the reliability of lead-free surface mount assemblies

Published:2001-06 Issue:2 Volume:24 Page:241-249
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Davitt E.,Stam F.A.,Barrett J.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/20041/00926389.pdf?arnumber=926389

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improved method for determining the shear strength of chip component solder joints;Microelectronics Reliability;2010-02

2. Microstructural evolution of Sn–Ag–Cu–Al solder with respect to Al content and heat treatment;Journal of Materials Research;2002-09

3. Reliability of lead-free solder interconnects-a review;Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)

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