Defect Free Lamination of Low Temperature Co-Fired Ceramic Multi-Chip-Modules-Reference-Cited by-同舟云学术

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Defect Free Lamination of Low Temperature Co-Fired Ceramic Multi-Chip-Modules

Published:2024-06-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2024 International Conference on Integrated Circuits, Communication, and Computing Systems (ICIC3S)
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Author:

V Anil Kumar P N¹,Viswambhara Pabolu¹,Surendranath Kilaru¹,Srivastava Prakhar Kumar¹,Chaturvedi Ishan¹,Singh Harimohan¹,Prajapati Kaushik¹,Parmar Harishkumar¹,Naranbhai Luhar Rakeshkumar¹,Sinha Santanu¹,Kumar Punam Pradeep¹

Affiliation:

1. Space Applications Centre, ISRO,Ahmedabad,India

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10602773/10602837/10603305.pdf?arnumber=10603305

Reference12 articles.

1. Thick-film sensors: past, present and future;White

2. Ceramic multilayer gas sensors - an overview;Moos

3. Application of graphite-based sacrificial layers for fabrication of LTCC (low temperature co-fired ceramic) membranes and micro-channels

4. Preparation and application of minerals-based sacrificial pastes for fabrication of LTCC structures;Birol

5. 3D structuration techniques of LTCC for microsystems applications;Fournier,2010

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