Author:
Doyle Matthew,Becker Wiren D.,Cocchini Matteo,Schoneck Kyle,Connor Samuel,Berge Layne,Bai Siqi,Drewniak James
Cited by
2 articles.
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1. A Thermal-aware DC-IR Drop Analysis for 2.5D IC;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
2. Physics-Based Modeling for Determining Transient Current Flow In Multi-layer PCB PI Designs;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01