Advanced HDFO Packaging Solutions for Chiplets Integration in HPC Application
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501736.pdf?arnumber=9501736
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Reliability and Chiplets;IEEE Reliability Magazine;2024-06
2. High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express;Nature Electronics;2024-02-19
3. Simulation on Interplay Between Morphological Evolution and Defect in Polycrystalline TSV During EM;IEEE Transactions on Electron Devices;2024-01
4. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
5. Flip Chip Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
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