Author:
Yin Pengcheng,Park Seungbae,Pandiarajan Ganesh
Cited by
3 articles.
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1. Ionic Sensor Package Design for the Survivability in a Drop/Impact During Deployment;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Enhanced Foam Package Design for Drop/Impact Using Accurate Predictive Simulation;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-05
3. Package Design Through Reliable Predictive Modeling and Its Validation;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05