POL tile as a small package for a power module-Reference-Cited by-同舟云学术

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POL tile as a small package for a power module

Published:2022-03-20 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE Applied Power Electronics Conference and Exposition (APEC)
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Author:

Murayama Kei¹,Kaneko Amane¹,Aizawa Mitsuhiro¹,Hayashibe Shingo¹,Oi Kiyoshi¹

Affiliation:

1. Shinko Electric Industries Co., Ltd,R & D Div.,Process Development Dept,Nagano,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9773364/9773365/09773543.pdf?arnumber=9773543

Reference7 articles.

1. Evaluation of Encapsulation Resin Structure for POL Tile;murayama;Proceedings of PCIM Europe 2021,2021

2. Study of POL tile using Ag sintering material;murayama;Proceedings of PCIM Europe 2020,2020

3. Evaluation of Ag-sinter and CuSn-Tlp based joining technologies on lead frame;otto;Proceedings of PCIM Europe 2018,2018

4. Temperature Cycling;JEDEC Standards Report JESD22-A104-B,2000

5. Thermal Characteristic Evaluation of Silver and Copper Sintering Materials

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A New Inductor Assembly Method for POL Power Module 3D Packaging;2023 2nd Asia Power and Electrical Technology Conference (APET);2023-12-28

2. Thermal stress reliability comparison of WB and POL-kW structure by Power cycling and simulation;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19

3. Study on thermal stress behavior of mold type POL tile;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19

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