Simulation of Thermo Mechanical Properties and Reliability of Power IGBT Module-Reference-Cited by-同舟云学术

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Simulation of Thermo Mechanical Properties and Reliability of Power IGBT Module

Published:2022-10-23 Issue: Volume: Page:
ISSN:
Container-title:2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)
language:
Short-container-title:

Author:

Koval F.¹,Chvala A.¹

Affiliation:

1. Institute of Electronics and Photonics, Slovak University of Technology in Bratislava,Bratislava,Slovakia,812 19

Funder

ECSEL Joint Undertaking

Slovak Research and Development Agency

Ministry of Education, Science, Research, and Sport of Slovakia

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9966729/9966739/09966740.pdf?arnumber=9966740

Reference5 articles.

1. Effective 3-D Device Electrothermal Simulation Analysis of Influence of Metallization Geometry on Multifinger Power HEMTs Properties

2. Reliability Improvement of Power Converters by Means of Condition Monitoring of IGBT Modules

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