Read Disturbance in Cross-Point Phase-Change Memory Arrays—Part II: Array Simulations Considering External Currents

Author:

Kim Donguk1,Jang Jun Tae1ORCID,Kim Changwook1ORCID,Kim Hyun Wook2,Hong Eunryeong2ORCID,Ban Sanghyun3ORCID,Shin Minchul3,Lee Hanwool3,Lee Hyung Dong3,Mo Hyun-Sun1,Woo Jiyong2ORCID,Kim Dae Hwan1ORCID

Affiliation:

1. School of Electrical Engineering, Kookmin University, Seoul, South Korea

2. School of Electronic and Electrical Engineering, Kyungpook National University, Daegu, South Korea

3. SK Hynix, Gyeonggi-do, South Korea

Funder

SK Hynix

National Research Foundation of Korea (NRF) through the Korean Government

Institute of Information and Communications Technology Planning and Evaluation (IITP) through Korea Government

National Research Foundation (NRF) through Korea Government

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Reference24 articles.

1. Access devices for 3D crosspoint memory;burr;J Vac Sci Technol B Nanotechnol Microelectron Mater Process Meas Phenom,2014

2. A stackable cross point phase change memory;kau;IEDM Tech Dig,2009

3. Innovative PCM+OTS device with high sub-threshold non-linearity for non-switching reading operations and higher endurance performance

4. A Study on OTS-PCM Pillar Cell for 3-D Stackable Memory

5. Mg-Te OTS selector with low Ioff(< 100 pA), fast switching speed (?d = 7 ns), and high thermal stability (400 °C/30min) for X-point memory applications;lee;Proc Symp VLSI Technol,2021

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