NH3 PDA Temperature-Impact on Low-Frequency Noise Behavior of Si0.7Ge0.3 pFinFETs
Author:
Affiliation:
1. School of Electronic Engineering, Xi’an University of Posts and Telecommunications, Xi’an, China
2. imec, Leuven, Belgium
Funder
Shaanxi Provincial Innovation Team Project
Xi’an Municipal Sciences Plan Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/16/9967813/09926045.pdf?arnumber=9926045
Reference43 articles.
1. EOT of 0.62 nm and High Electron Mobility in La-silicate/Si Structure Based nMOSFETs Achieved by Utilizing Metal-Inserted Poly-Si Stacks and Annealing at High Temperature
2. Investigation of ALD or PVD (Ti-rich vs. N-rich) TiN metal gate thermal stability on HfO2 high-K;wu;VLSI Tech Dig,2010
3. Analog Performance and its Variability in Sub-10 nm Fin-Width FinFETs: a Detailed Analysis
4. DC Performance Variations of SOI FinFETs with Different Silicide Thickness
5. Direct evaluation of low-field mobility and access resistance in pentacene field-effect transistors
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