Solid state MEMS devices on flexible and semi-transparent silicon (100) platform
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6749560/6765550/06765699.pdf?arnumber=6765699
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Sensitivity enhanced flexible capacitive pressure sensor microstructure optimization for biomedical applications;Engineering Research Express;2024-05-31
2. Recent Progress on Flexible Capacitive Pressure Sensors: From Design and Materials to Applications;Advanced Materials Technologies;2021-03-05
3. Simulation and Fabrication of Piezoelectrically Actuated Nozzle/Diffuser Micropump;2019 IEEE SENSORS;2019-10
4. Mechanisms and Materials of Flexible and Stretchable Skin Sensors;Micromachines;2017-02-28
5. Sandwich structure based on back-side etching silicon (100) wafers for flexible electronic technology;Microsystem Technologies;2015-11-30
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