Funder
Hong Kong Innovation and Technology Fund (ITF) Grant through The Hong Kong University of Science and Technology-Massachusetts Institute of Technology (HKUST-MIT) Research Consortium
Guangzhou Science, Technology and Innovation Commission
Guangdong Science and Technology
Research Exchange Funding of the Ministry of Education
Natural Science Foundation of Guangdong Province
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Mechanical Engineering