Experimental and Modeling Based Investigations of Process Parameters on a Novel, 3D Printed and Self-Insulated 24-Well, High-Throughput 3D Microelectrode Array Device for Biological Applications-Reference-Cited by-同舟云学术

Experimental and Modeling Based Investigations of Process Parameters on a Novel, 3D Printed and Self-Insulated 24-Well, High-Throughput 3D Microelectrode Array Device for Biological Applications

Published:2022-06 Issue:3 Volume:31 Page:358-371
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:
Short-container-title:J. Microelectromech. Syst.

Author:

Manrique Castro Jorge¹^ORCID,Rajaraman Swaminathan²^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, NanoScience Technology Center, University of Central Florida, Orlando, FL, USA

2. Department of Materials Science and Engineering, Department of Electrical and Computer Engineering, NanoScience Technology Center, Burnett School of Biomedical Sciences, University of Central Florida, Orlando, FL, USA

Funder

University of Central Florida (UCF) Research Foundation (RF) Funding using GAP Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://xplorestaging.ieee.org/ielx7/84/9785947/09744493.pdf?arnumber=9744493

Reference49 articles.

1. Fabrication and Characterization of 3D Printed, 3D Microelectrode Arrays for Interfacing with a Peripheral Nerve-on-a-Chip

2. Properties of polymeric materials for optical systems;stefka;Proc SPIE,0

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