A study of large area bonding technologies and their application in electronic industry
Author:
Affiliation:
1. Heraeus Materials Technology Shanghai, Ltd.,Heraeus Electronics,Shanghai,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872601.pdf?arnumber=9872601
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5. Thermal transient characteristics of die attach in high power LED PKG
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