Stress Analysis and Optimization of BGA Solder Joints Under Thermal Fatigue Loading by Solder Joint Structural Parameters-Reference-Cited by-同舟云学术

Stress Analysis and Optimization of BGA Solder Joints Under Thermal Fatigue Loading by Solder Joint Structural Parameters

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Liu Xiaobin¹,Huang Chunyue¹,Wu Liye¹,Wang Lilin¹,Liu Xianjia¹,Zhang Huaiquan¹

Affiliation:

1. Guilin University of Electronic Technology,School of Electronic Mechanical Engineering,Guilin,China

Funder

Science and Technology Major Project of Guangxi

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872735.pdf?arnumber=9872735

Reference7 articles.

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3. Thermal placement optimization for embedded resistances based on orthogonal design and fuzzy genetic algorithm

4. Stress-strain analysis and optimization of welded joints of plate level components under bending-vibration composite loading[D];chao;Guilin University of Electronic Technology,2021

5. Analysis of factors influencing patient care outcomes after vitrectomy combined with intraocular filling based on SPSSAU software[J];zelin;Software,2020

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1. Stress analysis and optimization of pop package under random vibration loading;IEICE Electronics Express;2023-11-25

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