Crystal structure informed mesoscale deformation model for HCP Cu<sub>6</sub>Sn<sub>5</sub> intermetallic compound-Reference-Cited by-同舟云学术

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Crystal structure informed mesoscale deformation model for HCP Cu₆Sn₅ intermetallic compound

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Kunwar Anil¹,Ma Haoran²,Hektor Johan³

Affiliation:

1. Silesian University of Technology,Faculty of Mechanical Engineering,Gliwice,Poland,44-100

2. Dalian University of Technology,School of Microelectronics,Dalian,China,116024

3. Malmö University,Faculty of Technology and Society,Department of Materials Science and Applied Mathematics,Malmö,Sweden,21119

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873310.pdf?arnumber=9873310

Reference15 articles.

1. Multi-phase ELAStic Aggregates (MELASA) software tool for modeling anisotropic elastic properties of lamellar composites

2. ELATE: an open-source online application for analysis and visualization of elastic tensors

3. Single Crystal Plasticity Finite Element Analysis of Cu6Sn5 Intermetallic

4. MOOSE: Enabling massively parallel multiphysics simulation

5. A Continuum Dislocation Dynamics Crystal Plasticity Approach to Irradiated Body-Centered Cubic α-Iron

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