A novel low cost wafer level hermetic packaging approach for the implantable devices
Author:
Affiliation:
1. Information Engineering University,PLA Strategic Support Force,Zhengzhou,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873183.pdf?arnumber=9873183
Reference9 articles.
1. design and fabrication of corrosion and humidity sensors for performance evaluation of chip scale hermetic packages for biomedical implantable devices;saeidi;2009 European Microelectronics and Packaging Conference EMPC,2009
2. Micro- and nano-electro mechanical (MEMS and NEMS)-based technologies for implanted biomedical devices
3. Biocompatible packaging for implantable miniaturized pressure sensor device used for stent grafts: Concept and choice of materials
4. An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test
5. Review of test methods used for the measurement of hermeticity in packages containing small cavities
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