Effect of Al<sub>2</sub>O<sub>3</sub> gradation on rheological behavior and thermomechanical properties of epoxy molding Compounds-Reference-Cited by-同舟云学术

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Effect of Al₂O₃ gradation on rheological behavior and thermomechanical properties of epoxy molding Compounds

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Xie Xin¹,Zhang Mengdi²,Fu Kexin²,Ai Wenji²,Zhu Pengli²,Xie Qing¹

Affiliation:

1. North China Electric Power University,State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources,Beijing,China

2. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873269.pdf?arnumber=9873269

Reference15 articles.

1. Pyrolysis behavior of polysilazane and polysilazane-coated-boron nitride for high thermal conductive composite

2. Chemically modified boron nitride-epoxy terminated dimethylsiloxane composite for improving the thermal conductivity

3. Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers

4. Estimation on thermal conductivities of filled polymers

5. Study of high thermal conductive epoxy resins containing controlled high-order structures

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