Failure Analysis of Thin Film Resistors in High Temperature and High Humidity Environment-Reference-Cited by-同舟云学术

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Failure Analysis of Thin Film Resistors in High Temperature and High Humidity Environment

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
Short-container-title:

Author:

Liu Lixia¹,Lu Zhenqiang²,Cai Yali³,Yu Liang³,Dai Wenbin³,Zhang Lei⁴,Mai Jun²,Jia Tingting⁵,Yu Shuhui³

Affiliation:

1. Shenzhen Institute of Advanced Electronic Materials,Shenzhen,China

2. Guangdong Fenghua Advanced Technology Holding Co., Ltd.,Zhaoqing,China

3. Chinese Academy of Sciences,Shenzhen Institutes of Advanced Technology,Shenzhen,China

4. Shenzhen Institute of Advanced Technology Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials,Shenzhen,China

5. Shenzhen Institute of Advance Electronic Materials,Shenzhen,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873230.pdf?arnumber=9873230

Reference20 articles.

1. Sulfuration mechanism and failure prevention of thick film chip resistors;wang;Electronic Components and Materials,2013

2. Expected termination times of progressively Type‐I censored step‐stress accelerated life tests under continuous and interval inspections

3. Mechanism of Conductive Layer Suffer from Sulfide Corrosion and Failure Analysis of Thick Film Chip Resistors;chang;Environmental Technology,2021

4. Analysis of open circuit failure of chip resistors;lei;Electronic Components & materials,2000

5. Failure Mode and Failure Mechanism Analysis of Surface Mounting Resistor;fan;Environmental Technology,2019

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