Cold Sintering Process for Fabrication of a Ceramic Substrate with the Copper Layer
Author:
Affiliation:
1. Huazhong University of Science and Technology,School of Mechanical Science and Engineering,Wuhan,China
2. Huazhong University of Science and Technology,School of Aerospace Engineering,Wuhan,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873311.pdf?arnumber=9873311
Reference14 articles.
1. Microwave dielectric properties of cold sintered Al2O3-NaCl composite
2. Anisothermal densification kinetics of the cold sintering process below 150 °C
3. Broad temperature dependence, high conductivity, and structure-property relations of cold sintering of LLZO-based composite electrolytes
4. Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler
5. White LEDs With High Optical Consistency Packaged Using 3D Ceramic Substrate
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