1. Investigation of PBGA solder joint failure in reflow process [J];guo;Machinery Design & Manufacture,2018
2. Failure Reason analysis of open solder joints of PBGA assembly and optimization of soldering process [J];fan;Environmental Technology,2018
3. Thermal-mechanical fatigue reliability of pbsnag solder layer of die attachment for power electronic devices[C];xinpeng;2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP),2009
4. Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples
5. Reliability and Thermal Fatigue Life Prediction model of Solder Joints in electronic Packaging [C];xiaorui;Annual Conference of Beijing Dynamic Society,2013