Optimizing Thermal Properties of Thermal Interface Materials Using the Adhesion Mechanism of Gecko’s Setae
Author:
Affiliation:
1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China
2. Nanchang University,School of Physics and Materials Science,Nanchang,China
Funder
Research and Development
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872543.pdf?arnumber=9872543
Reference7 articles.
1. Recent breakthroughs and perspectives of high-energy layered oxide cathode materials for lithium ion batteries
2. Bioinspired, Highly Adhesive, Nanostructured Polymeric Coatings for Superhydrophobic Fire-Extinguishing Thermal Insulation Foam
3. Gecko-inspired adhesive structures enable efficiently thermal conductance and vibration dissipation in a highly mismatched system
4. Solvent-free, supersoft and superelastic bottlebrush melts and networks
5. High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip
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