Influence of package parasitic parameters on CDM performance based on 2.5D and 2D package-Reference-Cited by-同舟云学术

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Influence of package parasitic parameters on CDM performance based on 2.5D and 2D package

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Long Zhijun¹,Liu Nie¹,Yang Dan¹,Mei Na²,Sun Tuobei²

Affiliation:

1. Sanechips Technology Co., Ltd,Shenzhen,P.R.China

2. ZTE Corporation,State Key Laboratory of Mobile Network and Mobile Multimedia Technology,Shenzhen,P.R.China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873303.pdf?arnumber=9873303

Reference4 articles.

1. Measurement Process Optimization in Using Lock-in Thermography for Fault Localization of CoWos Packages

2. Influence of Package Trace Properties on CDM Stress

3. Charged Device Model Reliability of Three-Dimensional Integrated Circuits

4. CDM peak current variations and impact upon CDM performance thresholds

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Influence of Pin Position on CDM Peak Current of Chips Based on Large-Sized CoWoS Package;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

2. Influence of pin position on the CDM peak current based on 2.5D and 2D package;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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