Reliability Study of WLP for SAW Filter with Through Film Vias Using Laser Drilling technology-Reference-Cited by-同舟云学术

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Reliability Study of WLP for SAW Filter with Through Film Vias Using Laser Drilling technology

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
Short-container-title:

Author:

Chen Zuohuan¹,Zhao Jin²,Zhang Jiqin³,Zhang Long³,Yu Daquan¹

Affiliation:

1. Xiamen University,School of Electronic Science and Engineering (National Model Microelectronics College),Xiamen,China

2. Beijing University of Technology,Institute of Electronics Packaging Technology and Reliability Faculty of Materials and Manufacturing,Beijing,China

3. Xiamen Sky Semiconductor Technology Co. Ltd.,Xiamen,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873207.pdf?arnumber=9873207

Reference5 articles.

1. Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes

2. Stress Issues in 3D Interconnect Technology Using Through Glass Vias;zhao;Journal of Mechanical Engineering,2022

3. Warpage Characteristic of Glass Interposer with Different CTE's and Thickness

4. Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology

5. Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter;chen;SENSORS,0

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