Review of thermal characteristics simulation analysis of electronic components-Reference-Cited by-同舟云学术

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Review of thermal characteristics simulation analysis of electronic components

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Ma Chi¹,Tu Yuan²,Ren Yan¹,Zhou Shengze¹,Wang Zhizhe¹

Affiliation:

1. China Electronic Product Reliability and Environmental Testing Research Institute,Components and Materials Research Departmen,Guangzhou,China

2. China Electronic Product Reliability and Environmental Testing Research Institute,Electronic Component Inspection and Testing Center,Guangzhou,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872700.pdf?arnumber=9872700

Reference42 articles.

1. PSpice-COMSOL-Based 3-D Electrothermal–Mechanical Modeling of IGBT Power Module

2. Research on failures of bonding wire in IGBTs module;wendong,2016

3. Field-circuit coupling modeling and multi-rate electro-thermal co-simulation analysis of merged PiN schottky SiC diode;yingjie;Proceedings of the CSEE,2019

4. IGBT electro-thermal simulation under dynamic avalanche condition considering distribution of electro-thermal stress on chip;tianzhao;Proceedings of the CSEE,2021

5. Electrothermal Modeling of the Insulated Gate Bipolar Transistor (IGBT) Using PSpice: Application to DC–DC Converter

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design of 150°C DC–DC Converter Based on Flyback Topology for Downhole Drilling Equipment;IEEE Access;2023

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