Research on key technology of the microchannel of a novel LTCC substrate
Author:
Affiliation:
1. No.10 Institute of China Electronic Technology Corporation,Cheng Du,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873403.pdf?arnumber=9873403
Reference30 articles.
1. Processing of graphite-based sacrificial layer for microfabrication of low temperature co-fired ceramics (LTCC)
2. Single-phase liquid cooled microchannel heat sink for electronic packages
3. Experiments of the Transport Performance of Micro-channel Cold-plate;ping;Journal of Wuhan University of Technology,2009
4. Study on Heat Dissipation Performance of LTCC Substrate with High Thermal Conductivity;gang;Electronics Process Technology,2020
5. Microchannel Heatsink Cooling for High Power Semiconductor Diode Lasers;zhi-feng;Journal of Chengdu University of Science and Technology,2003
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