Molecular rigidity and surface tension effect of silane coupling agent on the performance tailoring of underfill
Author:
Affiliation:
1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872576.pdf?arnumber=9872576
Reference5 articles.
1. Preparetion and properties of SiO 2 filled underfills with controllable chemical groups on the surface of filler;zhang;2020 21st International Conference on Electronic Packaging Technology (ICEPT),2020
2. The structure of γ-aminopropyltriethoxysilane films on iron mirrors
3. Flow time measurements for underfills in flip-chip packaging
4. Effect of underfill design parameters on die cracking in flip chip on flexible substrates
5. Effect on Filling Time for a Non-Newtonian Flow During the Underfilling of a Flip Chip
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