Effect of Temperature Shock Testing Profile SiC Power Module Reliability
Author:
Affiliation:
1. Fudan University,Institute of Future Lighting, Academy for Engineering and Technology,Shanghai,200433
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873322.pdf?arnumber=9873322
Reference20 articles.
1. A Simulation of Intelligent Power Module under Power Cycling Test Condition [C];yong;ICEPT-HDP 2014 Proceedings - 2014 International Conference on Electronic Packaging Technology,2014
2. Finite element modeling predicts the effects of voids on thermal shock reliability and thermal resistance of power device [J];chang;Welding Journal,2006
3. Solder Joint Reliability
4. Fatigue Life Predictions for Thermally Loaded Solder Joints Using a Volume-Weighted Averaging Technique
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2. Local Interconnection Degradation of a Double-Sided Cooling SiC MOSFET Module under Power Cycling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023
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