Large area pressureless Cu-Cu bonding using formic acid-treated Cu particles for power device packaging-Reference-Cited by-同舟云学术

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Large area pressureless Cu-Cu bonding using formic acid-treated Cu particles for power device packaging

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Xu Yu¹,Dai Dongfang²,Yang Renbin²,Qian Jing²,Wang Ping¹,Chen Xianping¹

Affiliation:

1. Chongqing University,Education Ministry of China and State Key Laboratory of Power Transmission Equipment & System Security and New Technology,Chongqing,China

2. Chongqing University,Key Laboratory of Optoelectronic Technology & Systems, School of Optoelectronic Engineering,Chongqing,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873355.pdf?arnumber=9873355

Reference9 articles.

1. Cu-Cu Thermocompression Bonding with Cu-Nanowire Films for Power Semiconductor Die-Attach on DBC Substrates

2. Study of Cu-Cu low temperature direct bonding and contact resistance measurement on bonding interface

3. Cu-Cu direct bonding technology using ultrasonic vibration for flip-chip interconnection

4. A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere

5. Surface effect induced Cu-Cu bonding by Cu nanosolder paste

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections;Nanomaterials;2022-11-29

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