Micro-solder Fatigue Life Study Based on Crack Propagation Mechanism for High Reliability FC-CSP-Reference-Cited by-同舟云学术

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Micro-solder Fatigue Life Study Based on Crack Propagation Mechanism for High Reliability FC-CSP

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Wang Bei¹,Xia Dongmei¹,Liu Zuyao¹,Zhang Long²,Liao Chengyu³,Liu Lu¹

Affiliation:

1. Shenzhen Kaifa Technology Co., Ltd.,Technology Research and Central Lab,Shenzhen,China

2. Dongguan Kaifa Technology Co., Ltd.,Engineering Technology Lab,Dongguan,China

3. Payton Technology(Shenzhen) Co., Ltd.,Advanced Packaging Research Center,Shenzhen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873143.pdf?arnumber=9873143

Reference8 articles.

1. Correlation of reliability models including aging effects with thermal cycling reliability data

2. Effect of simulation methodology on solder joint crack growth correlation

3. Thermal cycle fatigue life prediction for flip chip solder joints

4. Effect of glass transition slope of underfill on solder joint fatigue life

5. Thermal cycling reliability of aged PBGA assemblies - comparison of Weibull failure data and finite element model predictions

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